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ISTC2007, MARCH 18-20, 2007, SHANGHAI, CHINA
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COMMITTEE |
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Conference Honorary Chairmen |
Prof. Yang-Yuan Wang |
Honorary Chairman |
Peking University and SMIC |
Academician of Chinese Academy of Sciences |
Prof. Shi-Chang Zou |
Honorary Chairman |
GSMC |
Academician of Chinese Academy of Sciences |
International Advisory Committee |
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Dr. Ming Yang |
Chairman |
IC Spectrum, Chairman&CEO, China |
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Dr. Simon Deleonibus |
Member |
CEA-LETI, France |
Prof. Bill Miline |
Member |
Cambridge University, England |
Prof. Juin J. Liou |
Member |
University of Central Florida, USA |
Prof. Mitsu Koyanagi |
Member |
Tohoku University, Japan |
Prof. Jin Goo Park |
Member |
Hanyang University, Korea |
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Dr. Hsing-Huang Tseng |
Member |
SEMATECH, USA |
Conference Chairmen |
Dr. Tomi Li |
Chairman |
Applied Materials, Inc., USA |
Dr. Qingyuan Han |
Co-Chairman |
Axcelis Technologies, Inc., USA |
Prof. Hiroshi Iwai |
Co-Chairman |
Tokyo Institute of Technology, Japan |
Dr. Fei Xu |
Co-Chairman |
GSMC, China |
Executive Committee |
Dr. Tomi Li |
Chairman |
Applied Materials, Inc., USA |
Dr. Qingyuan Han |
Co-Chair |
Axcelis Technologies, Inc., USA |
Prof. Hiroshi Iwai |
Co-Chair |
Tokyo Institute of Technology, Japan |
Dr. Fei Xu |
Co-Chair |
GSMC, China |
Dr. Swami Mathad |
Secretary |
S/C Tech. Consulting, USA |
Dr. Hanming Wu |
Member |
SMIC, China |
Dr. David P. Huang |
Member |
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Prof. Cor Claeys |
Member |
IMEC, Belgium |
Dr. Sowmya Krisnan |
Member |
Ultra Clean Technology, USA |
Dr. Tim Turner |
Member |
Chiron Technology, USA |
Dr. Qiang Wu |
Member |
HHNEC, China |
Dr. Youfan Liu |
Member |
Intel , USA |
Dr. Qinghuang Lin |
Member |
IBM , USA |
Dr. Simon Chang |
Member |
Texas Instruments, USA |
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Dr. David Sheng |
Member |
TSMC |
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BEST STUDENT PAPER AWARD |
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ISTC announces its inaugural Best Student Paper A ward for the upcoming 2007 annual conference which will be held on March 18-20,2007 in Holiday Inn £¬ Pudong Shanghai P.R.China . The purpose of this Competition is to encourage the learning and researching interest in semiconductor technology, to explore the significant science meaning of the semiconductor field, to bring the potential world-class talent to the semiconductor industry, and to further improve the inter-communication between the student and the employer. T his award is to recognize the outstanding paper prepared and submitted to the conference by a full-time student. |
Topic: Topic of the participating paper should be pertinent to the scopes of any of the ISTC divisions
Eligible Participants: full time students, including PhDs , Master and BS students;
Application Procedure:
1. A 250-word abstract indicating which session the papers include;
2. Biography of the student;
3. A copy of the student card;
4. A recommendation letter from the student advisor;
E -mail to : ISTC2007@ecsa si a.org by October 30, 2006 ;
5. Sending out Paper acceptance notifications by November 15, 2006 ;
6. Full papers are due by December 30, 200 6 ;
Selection: ISTC student paper award committee members will review the submitted papers to appraise the technical competence, significance of findings, originality, and clarity of expression of the finalists. The winner will be informed before January 30 , 2007 and will be officially announced on Day One Conference, March 19, 2007.
Award: A check of $500 as well as a Certificate of ISTC'07 Best Student Paper will be presented by the conference chair to the winner. Special recognition will be given to the winning paper in the Conference Proceedings. |
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SESSIONS COMMITTEE |
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Division I Advanced Processing |
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Chairman |
Hanming Wu |
SMIC, China |
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Co-Chairman |
Ruiping Wang |
Applied Materials, Inc., USA |
Co-Chairman |
Qingyuan Han |
Axcelis Technologies, Inc., USA |
Member |
Yu-Long Jiang |
Fudan University, China |
Member |
Chenting Lin |
ECI Technology, USA |
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Division II CMP |
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Chairman |
David P. Huang |
Praxair Inc., USA |
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Co-Chairman |
Wei-Chung Yu |
Rohm & Haas, USA |
Co-Chairman |
Dr. Fei Xu |
GSMC, China |
Member |
Dr. Gary Ding |
Intel. USA |
Member |
Renhe Jia |
Applied Materials, Inc., USA |
Member |
Uday Mahajan |
KLA Tencor, USA |
Member |
Srini Raghavan |
Intel / University of Arizona , US |
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Division III Device, Modeling, & Reliability |
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Chairman |
Cor Claeys |
IMEC, Belgium |
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Co-Chairman |
Ru Huang |
Peking University, China |
Co-Chairman |
Prashant Majhi |
Sematech, USA |
Member |
Dr. Waism Wong |
SMIC |
Member |
Sunil Wickramanayaka |
Anelva Corporation, Japan |
Member |
Albert Wang |
Illinois Institute of Technology, USA |
Member |
Summer Tseng |
SMIC, China |
Division IV Equipment and Materials |
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Chairman |
Sowmya Krisnan |
UCT, USA |
Co-Chairman |
Wei Chen |
Dow Corning, USA |
Co-Chairman |
Masayasu Tanjyo |
Nissin, Japan |
Member |
Jack Kuo |
LAM Research, USA |
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Division V Manufacturing Science |
Co-Chairman |
Kazuya Ohuchi
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Toshiba, Japan |
Co-Chairman |
David Sheng |
TSMC |
Member |
H. K. Lin |
SMIC, China |
Member |
Tom Fu |
Chartered |
Division VI Photolithography |
Chairman |
Qiang Wu |
HHNEC, China |
Co-Chairman |
Zewen Liu |
Tsinghua University,China |
Co-Chairman |
Odd Hung |
Chartered, Singapore |
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Member |
Qinghuang Lin |
IBM, USA |
Member |
Simon Chang |
Texas Instruments, USA |
Member |
Hooi Soon |
Ellipsiz Ltd, Singapore |
Division VII Packaging and Assembly |
Chairman |
Youfan Liu |
Intel, USA |
Co-Chair |
Howard Li |
Applied Materials, USA |
Co-Chair |
Dr. Ivy Qin |
K&S |
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